With the gradual development of consumer electronics towards lighter, thinner, and more intelligent applications, higher requirements have been put forward for display technology and data transfer machine processing capabilities. The diversification of applications and the lightness of volume have also prompted printed circuit boards to arrange more wires within a limited area, continuously developing towards ultra fine directions such as line width, wiring density, and process precision. High density, lightness, flexibility, rigid flexible combination, and environmentally friendly production have gradually become the direction of future development.
Leading domestic soft board technology
The combination of software and hardware can reach up to 16 layers or more
HDI technology
Diversified selection of sheet materials
Minimum plate thickness 0.30mm
Fine line 50/50um