Products & Services

HDI PCBs

Using materials such as ordinary board (FR4) and high-speed board (modified FR4, PPO), the product features high line distribution density, thin thickness, and small size through precise wiring and laser micro hole conduction design.
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Technical capability：

  1. Number of floors: 4-12 floors

  2. Maximum delivery plate: 570mm x 720mm

  3. Maximum copper thickness (inner/outer): 3oz/2oz

  4. Maximum plate thickness: 3.5mm

  5. Maximum aspect ratio: 15:1

  6. Surface treatment: lead-free tin spraying, sinking gold, OSP, gold fingers




Technical characteristics：

  • Precision wiring design with line width/spacing ≥ 2.0/2.0 mil (50.8/50.8 μ m)；

  • Optional through hole, buried hole, laser micro hole and other conductive designs；

  • Designs such as POFV, 3+N+3, ELIC, stepped, and embedded (planar resistors, discrete devices, heat dissipation copper blocks, etc.) can be used.





应用领域
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