High Speed PCB

Technical capability：

①Number of floors: 4-12 floors

②Maximum delivery plate: 570mm x 720mm

③Maximum copper thickness (inner/outer): 3oz/2oz

④Maximum plate thickness: 3.5mm

⑤Maximum aspect ratio: 15:1

⑥Surface treatment: lead-free tin spraying, sinking gold, OSP, gold fingers

Technical characteristics：

①Precision wiring design with line width/spacing ≥ 2.0/2.0 mil (50.8/50.8 μ m)；

②Optional through hole, buried hole, laser micro hole and other conductive designs；

③Designs such as POFV, 3+N+3, ELIC, stepped, and embedded (planar resistors, discrete devices, heat dissipation copper blocks, etc.) can be used。