Multilayer PCBs

Technical capability：

①Number of floors: 2 to 30 floors

②Maximum delivery plate: 570mm x 720mm

③Maximum copper thickness (inner/outer): 12oz/12oz

④Maximum plate thickness: 7.0mm

⑤High aspect ratio: 15:1

⑥Surface treatment: lead-free tin spraying, sinking gold, OSP, gold fingers

Technical characteristics：

①Precision wiring design with line width/spacing ≥ 2.5/2.5mil (63.5/63.5 μ m)；

②Optional through hole, buried hole, mechanical blind hole and other conductive designs；

③Designs such as POFV, mixed voltage, local mixed voltage, stepped, and embedded (planar resistors, discrete devices, heat dissipation copper blocks, etc.) can be used。