RF PCB

Technical capability：

1.Number of floors: 2 floors/4 floors/6 floors/8 floors

2.Maximum delivery plate: 699mm * 594mm

3.Maximum copper thickness (inner/outer): 1-2oz

4.Maximum plate thickness: 3.0mm

5.Maximum aspect ratio: 10:1

6.Surface treatment: gold plating, silver plating, gold plating, tin plating, OSP

Technical characteristics：

1、Low dielectric constant and low loss factor, reducing signal attenuation and distortion。

2、Good impedance control ensures signal integrity and stability。

3、High precision circuit etching and drilling technology ensures the quality and reliability of circuit boards。