Buried copper blocks

Technical capability：

1.Number of floors: 4 floors/6 floors/8 floors/10 floors

2.Maximum delivery plate: 699mm * 594mm

3.Maximum copper thickness (inner/outer): 5oz

4.Maximum plate thickness: 5.0mm

5.Maximum aspect ratio: 12:1

6.Surface treatment: tin spraying, gold sinking, silver sinking, tin sinking, OSP, gold fingers

Technical characteristics：

• High thermal conductivity: Copper has better thermal conductivity than other metals, which can quickly transfer heat and lower the temperature of components.

•High reliability: Adopting special manufacturing processes to ensure tight bonding between copper blocks and substrates, improving the reliability of circuit boards.

• Space saving: Embedding copper blocks into the substrate does not take up additional board space, which is beneficial for achieving miniaturization and integration of circuit boards.

• Complex manufacturing process: Compared to traditional circuit boards, the manufacturing process of buried copper block boards is more complex, requiring higher technical level and production costs.

These characteristics have made buried copper block plates widely used in some fields that require high heat dissipation.